The wire bonder is used to make electrical connections to bond pads on fabricated devices using microscopic wires. This manual wire bonder is capable of ball bonding as well as wedge bonding using aluminum or gold wire.
- Ultrasonic wire bonding (ball bonding or wedge bonding)
- Aluminium and gold wires 0.0007" to 0.002" in diameter
- Ribbon bonds of dimensions 0.001" by 0.01"
- Each device wire type can have a maximum of 21 stitch bonds without cutting the wire - each with its individual ultrasonic power, time and force (high or low) settings